MAT's automatic placement machine

MAT's automatic placement machine equipment can be applied to: epoxy bonding process, eutectic bonding process, ultrasonic thermocompression bonding process, flip-chip bonding process, suitable for chip packaging, multi-chip module (MCM), Micro-electromechanical devices (MEMS), 3D chip packaging (Die Stacking), sensors and CCD sensitive devices, etc., different application processes depend on the configuration requirements of customers for equipment.

MAT6400 vertical machine;